Solvent and water-free epoxy-urethane glue, designed for gluing wood flooring of all sizes onto cement slabs, in-floor radiant heat systems, wood or chip-board underlayments, marble or ceramic floors suitably pretreated.
Available in both versions light and dark brown. Product certified EC1.
- Water- and solvent-free
- Complies with UNI 14293_2006
- Can be used on cement screeds, wood surfaces, tiles, marble, ceramics
PACK Bicomponent glue EPOCOL PLUS
|Availability||Reserved for professionals|
PREPARATION OF THE BASE
Old ceramic or marble floors
Wash thoroughly to remove all grease. To improve adhesion, abrade the surface and eliminate dust thoroughly (use abrasive disc in silicon carbide grain 16, carborundum disc or diamond tools). Prior to gluing, apply Carver HW 90 adhesion agent.
Cement porous subfloors
Before applying the glue it is advisable to solidify the base, giving one coat of Carver primer: V3a BZA, IP 48, IP 100, EPOPRIMER, UNIVERSAL (see the relative technical data sheets).
Porous hot flash anhydrite bases
Check that the damp content is less than 0,5%, use abrasion to remove the surface patina, and clean all dust off the product. Before beginning to spread the glue, apply one full impregnation coat of one of our primers: V3a BZA, IP 48 or EPOPRIMER (see the relative technical data sheets).
Cement subfloors with moisture content between 2% and 5%
Do a dampproof treatment with one of Carver primers V3a BZA, IP48, EPOPRIMER, SH 8000, UNIVERSAL (see the relative technical data sheets).
In-floor radiant heat systems
The slabs must be skilfully cast and sound. In case of superficial pulverization, do a dust preventing treatment giving one coat of EPOPRIMER, thinned 100% with DILUENTE EPO (see the relative technical data sheet). If these are not sufficiently compact, treat using BLOCKCEM binder (see the relative technical data sheet).
However, the moisture content at installation should be less than 1,5% (0,2% for resilient floorings). For more details on this operation contact our technical assistance department or consult the standard UNI 11371 2010.
Before installation, check the moisture content of the subfloor (max. 2%) and of the wood. This must be 9% ±2%.
Add component B to component A and mix until well amalgamated. Using a serrated spatula spread the glue on the subfloor, little by little on small areas, and lay the wood immediately, or anyway within 15-20 minutes.
Remember to adjust the pieces and hammer on them to enhance adhesion.
For the installation of resilient floorings, follow the same instructions given for wood floorings.
Acclimatize and apply wood and product at a temperature between +15°C and +35°C. Make sure that room relative humidity degree is less than 70%.
Pot life and hardening time are strongly affected by the temperature.
Avoid gluing the sides of the boards.
Sanding and finishing can start not before the accomplished stabilization of the wood.
Consumption may vary according to how much the subfloor absorbs.
We recommend to use rubber gloves during the APPLICATION
Any glue residue on floor can be immediately removed with Carver DILUENTE PR thinner. For varnished prefinished parquet use Carver NET PARQUET stain-remover.
Dispose of excess product and empty containers properly!
If the originals unopened containers are stored in a cool and dry place, the product will keep for at least 12 months.