Epoxy-polyurethane glue, free from solvents.
esigned for gluing wood flooring of all sizes on to cement slabs, including in-floor radiant heat systems, timber and chipboard, marble and ceramic floors suitably prepared.
Available in both versions light and dark brown.
- Solvent-free adhesive
- Designed for all types of wood flooring
- Can be used on cement screeds, wood surfaces, tiles, marble, ceramics
Pack Two-component glue E90
|Availability||Reserved for professionals|
SURFACE CHECK AND PREPARATION
SCREEDS MADE UP OF OLD TILES OR MARBLE FLOORING WITH MOISTURE CONTENT UNDER 2% OR 1.7% IN CASE OF IN-FLOOR RADIANT HEAT SYSTEM: wash thoroughly to remove all grease. To improve adhesion, abrade the surface and eliminate dust thoroughly (use abrasive disc in silicon carbide grain 16, carborundum disc or diamond tools).
POROUS CONCRETE SCREEDS WITH MOISTURE CONTENT UNDER 2%: before applying the glue it is advisable to solidify the base, giving one coat of BZA, EPOPRIMER o UNIVERSAL (see the relative technical data sheets).
ANHYDRITE POROUS CONCRETE SCREEDS: check that the damp content is less than 0.5%, abrade to remove the surface patina and clean all dust off the product. Before beginning to spread the glue, apply one full impregnating coat of one of our primers: BZA or EPOPRIMER (see the technical data sheets).
CEMENT SUBFLOORS WITH MOISTURE CONTENT BETWEEN 2% AND 5%: Before beginning to spread the glue, make a dampproof treatment with one of our primers: BZA, EPOPRIMER or UNIVERSAL (see the technical data sheets).
IN-FLOOR RADIANT HEAT SYSTEM: the slabs must be skillfully cast and sound. In case of superficial pulverization, do a dust preventing treatment giving one coat of UNIVERSAL or EPOPRIMER thinned with DILUENTE EPO (see the relative technical data sheet). However, the moisture content at installation should be less than 1,7% (0,2% for resilient floorings). For more details on this operation contact our technical assistance department or consult the standard UNI 11371 2010.
Before installation, check the moisture content of the subfloor (max. 2% or 1.7% on in-floor radiant heat system) and of the wood (this must be 9% ± 2%).Add component B to component A and mix until well amalgamated. Using a spatula (type E) spread the glue on the subfloor, little by little on small areas, and lay the wood immediately, or anyway within 15-20 minutes. Remember to adjust the pieces and hammer on them to enhance adhesion.
Acclimatize and apply wood and product at a temperature between +15°C and +35°C. Make sure that room relative humidity degree is from 10% to 70%.
Low temperatures and high room humidity levels slow product hardening and could reduce performance.
Pot life and hardening time are strongly affected by the temperature.
Avoid gluing the sides of the boards.
Sanding and finishing can start not before the accomplished stabilization of the wood.
Consumption may vary according to how much the subfloor absorbs.
We recommend to use rubber gloves during the application
Any glue residue on floor can be immediately removed with Carver NET PARQUET stain-remover.
For intermediate glue colour, always follow the 9:1 catalysis ratio, 1 kg of clear and dark component B mix can be catalysed with 9 Kg of component A.